View AM26LS31CDBRE4_9062360.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

an important notice at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. production data. am26ls31 , am26ls31c, am26ls31i , am26ls31m slls114k ? january 1979 ? revised july 2016 am26ls31 x quadruple differential line driver 1 1 features 1 ? meets or exceeds the requirements of ansi tia/eia-422-b and itu ? operates from a single 5-v supply ? ttl-compatible ? complementary outputs ? high output impedance in power-off conditions ? complementary output-enable inputs ? available mil-prf-38535-qualified options (m): all parameters are tested unless otherwise noted. on all other products, production processing does not necessarily include testing of all parameters. 2 applications ? motor encoders ? field transmitters: pressure sensors and temperature sensors ? military and avionics imaging ? temperature sensors or controllers using modbus 3 description the am26ls31 family of device s is a quadruple complementary-output line driver designed to meet the requirements of ansi tia/eia-422-b and itu (formerly ccitt) recommendation v.11. the 3-state outputs have high-current capability for driving balanced lines such as twisted-pair or parallel-wire transmission lines, and they are in the high- impedance state in the power-off condition. the enable function is common to all four drivers and offers the choice of an active-high or active-low enable (g, g) input. low-power schottky circuitry reduces power consumption without sacrificing speed. device information (1) part number package body size (nom) am26ls31mfk lccc (20) 8.89 mm 8.89 mm am26ls31mj cdip (16) 19.60 mm 6.92 mm am26ls31mw cfp (16) 10.30 mm 6.73 mm am26ls31cd soic (16) 9.90 mm 3.91 mm am26ls31cdb ssop (16) 6.20 mm 5.30 mm am26ls31cn pdip (16) 19.30 mm 6.35 mm am26ls31xns so (16) 10.30 mm 5.30 mm (1) for all available packages, see the orderable addendum at the end of the data sheet. schematic (each driver) 22 k to three other drivers common to all four drivers gnd enable g enable g v cc v v output y 9 input a 22 k 22 k all resistor values are nominal. output z 9 copyright ? 2016, texas instruments incorporated productfolder sample &buy technical documents tools & software support &community
2 am26ls31 , am26ls31c, am26ls31i , am26ls31m slls114k ? january 1979 ? revised july 2016 www.ti.com product folder links: am26ls31 am26ls31m submit documentation feedback copyright ? 1979 ? 2016, texas instruments incorporated table of contents 1 features .................................................................. 1 2 applications ........................................................... 1 3 description ............................................................. 1 4 revision history ..................................................... 2 5 pin configuration and functions ......................... 3 6 specifications ......................................................... 4 6.1 absolute maximum ratings ..................................... 4 6.2 esd ratings .............................................................. 4 6.3 recommended operating conditions ....................... 4 6.4 thermal information .................................................. 4 6.5 electrical characteristics .......................................... 5 6.6 switching characteristics ? am26ls31 .................... 5 6.7 switching characteristics ? am26ls31m ................. 5 6.8 typical characteristics .............................................. 6 7 parameter measurement information .................. 8 8 detailed description .............................................. 9 8.1 overview ................................................................... 9 8.2 functional block diagram ......................................... 9 8.3 feature description ................................................... 9 8.4 device functional modes ........................................ 10 9 application and implementation ........................ 11 9.1 application information ............................................ 11 9.2 typical application ................................................. 11 10 power supply recommendations ..................... 13 11 layout ................................................................... 13 11.1 layout guidelines ................................................. 13 11.2 layout example .................................................... 13 12 device and documentation support ................. 14 12.1 documentation support ........................................ 14 12.2 related links ........................................................ 14 12.3 receiving notification of documentation updates 14 12.4 community resources .......................................... 14 12.5 trademarks ........................................................... 14 12.6 electrostatic discharge caution ............................ 14 12.7 glossary ................................................................ 14 13 mechanical, packaging, and orderable information ........................................................... 14 4 revision history note: page numbers for previous revisions may differ from page numbers in the current version. changes from revision j (january 2014) to revision k page ? added applications section, the device information table, esd ratings table, feature description section, device functional modes , application and implementation section, power supply recommendations section, layout section, device and documentation support section, and mechanical, packaging, and orderable information section. ..... 1 ? split up switching characteristics table into two tables specified for each part ..................................................................... 5 changes from revision i (february 2006) to revision j page ? updated document to new ti data sheet format - no specification changes. ........................................................................ 1 ? deleted ordering information table. ....................................................................................................................................... 1 ? updated features. .................................................................................................................................................................. 1 ? added device and documentation support section. ............................................................................................................ 14
3 am26ls31 , am26ls31c, am26ls31i , am26ls31m www.ti.com slls114k ? january 1979 ? revised july 2016 product folder links: am26ls31 am26ls31m submit documentation feedback copyright ? 1979 ? 2016, texas instruments incorporated 5 pin configuration and functions d, db, n , ns, j, or w package soic, ssop, pdip , so, cdip, or cfp top view fk package 20-pin lccc top view pin functions pin i/o description name soic, ssop, pdip, so, cdip, or cfp lccc 1a 1 2 i logic data input to rs422 driver number 1 1y 2 3 o rs-422 data line (driver 1) 1z 3 4 o rs-422 data line (driver 1) g 4 5 i driver enable (active high) g 12 15 i driver enable (active low) 2a 7 9 i logic data input to rs422 driver number 2 2y 6 8 o rs-422 data line (driver 2) 2z 5 7 o rs-422 data line (driver 2) 3a 9 12 i logic data input to rs422 driver number 3 3y 10 13 o rs-422 data line (driver 3) 3z 11 14 o rs-422 data line (driver 3) 4a 15 19 i logic data input to rs422 driver number 4 4y 14 18 o rs-422 data line (driver 4) 4z 13 17 o rs-422 data line (driver 4) vcc 8 20 ? power input. connect to 5-v power source. gnd 16 10 ? device ground pin 19 20 1 3 2 17 18 16 15 14 13 12 11 9 10 5 46 7 8 4y4z nc g 3z 1z g nc 2z 2y 1y 1a nc v 4a gnd nc 3a 3y 2a cc 12 3 4 5 6 7 8 1615 14 13 12 11 10 9 1a1y 1z g 2z 2y2a gnd v cc 4a4y 4z g 3z3y 3a
4 am26ls31 , am26ls31c, am26ls31i , am26ls31m slls114k ? january 1979 ? revised july 2016 www.ti.com product folder links: am26ls31 am26ls31m submit documentation feedback copyright ? 1979 ? 2016, texas instruments incorporated (1) stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. these are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) all voltage values, except differential output voltage v od , are with respect to network gnd. 6 specifications 6.1 absolute maximum ratings over operating free-air temperature range (unless otherwise noted) (1) min max unit v cc supply voltage (2) 7 v v i input voltage 7 v output off-state voltage 5.5 v lead temperature 1,6 mm (1/16 in) from case for 10 s 260 c lead temperature 1,6 mm (1/16 in) from case for 60 s j package 300 c t stg storage temperature ? 65 150 c (1) jedec document jep155 states that 500-v hbm allows safe manufacturing with a standard esd control process. (2) jedec document jep157 states that 250-v cdm allows safe manufacturing with a standard esd control process. 6.2 esd ratings value unit v (esd) electrostatic discharge human-body model (hbm), per ansi/esda/jedec js-001 (1) 2000 v charged-device model (cdm), per jedec specification jesd22-c101 (2) 1000 6.3 recommended operating conditions min nom max unit v cc supply voltage am26ls31c 4.75 5 5.25 v am26ls31m 4.5 5 5.5 v ih high-level input voltage 2 v v il low-level input voltage 0.8 v i oh high-level output current ? 20 ma i ol low-level output current 20 ma t a operating free-air temperature am26ls31c 0 70 c am26ls31i ? 40 85 am26ls31m ? 55 125 (1) for more information about traditional and new thermal metrics, see the semiconductor and ic package thermal metrics application report. (2) the package thermal impedance is calculated in accordance with jesd 51-7. 6.4 thermal information thermal metric (1) am26ls31x unit d (soic) db (ssop) n (pdip) ns (so) 16 pins 16 pins 16 pins 16 pins r ja junction-to-ambient thermal resistance (2) 73 82 67 64 c/w r jc(top) junction-to-case (top) thermal resistance 38.1 ? ? 32.6 c/w r jb junction-to-board thermal resistance 34.7 ? ? 36.8 c/w jt junction-to-top characterization parameter 7.1 ? ? 4.2 c/w jb junction-to-board characterization parameter 34.4 ? ? 36.5 c/w
5 am26ls31 , am26ls31c, am26ls31i , am26ls31m www.ti.com slls114k ? january 1979 ? revised july 2016 product folder links: am26ls31 am26ls31m submit documentation feedback copyright ? 1979 ? 2016, texas instruments incorporated (1) for c-suffix devices, v cc min = 4.75 v and v cc max = 5.25 v. for m-suffix devices, v cc min = 4.5 v and v cc max = 5.5 v. (2) all typical values are at v cc = 5 v and t a = 25 c. (3) not more than one output should be shorted at a time, and duration of the short circuit should not exceed one second. 6.5 electrical characteristics over operating free-air temperature range (unless otherwise noted) (1) parameter test conditions min typ (2) max unit v ik input clamp voltage v cc = min, i i = ? 18 ma ? 1.5 v v oh high-level output voltage v cc = min, i oh = ? 20 ma 2.5 v v ol low-level output voltage v cc = min, i ol = 20 ma 0.5 v i oz off-state (high-impedance-state) output current v cc = min, v o = 0.5 v ? 20 a v o = 2.5 v 20 i i input current at maximum input voltage v cc = max, v i = 7 v 0.1 ma i ih high-level input current v cc = max, v i = 2.7 v 20 a i il low-level input current v cc = max, v i = 0.4 v ? 0.36 ma i os short-circuit output current (3) v cc = max ? 30 ? 150 ma i cc supply current v cc = max, all outputs disabled 32 80 ma 6.6 switching characteristics ? am26ls31 t a = 25 c, v cc = 5 v (see figure 11 ) parameter test conditions min typ max unit t plh propagation delay time, low- to high-level output c l = 30 pf, s1 and s2 open 14 20 ns t phl propagation delay time, high- to low-level output 14 20 t pzh output enable time to high level c l = 30 pf r l = 75 ? 25 40 ns t pzl output enable time to low level r l = 180 ? 37 45 t phz output disable time from high level c l = 10 pf, s1 and s2 closed 21 30 ns t plz output disable time from low level 23 35 t skew output-to-output skew c l = 30 pf, s1 and s2 open 1 6 ns 6.7 switching characteristics ? am26ls31m t a = 25 c, v cc = 5 v (see figure 11 ) parameter test conditions min max unit t plh propagation delay time, low- to high- level output c l = 30 pf, s1 and s2 open 30 ns t phl propagation delay time, high- to low- level output 30 t pzh output enable time to high level c l = 30 pf r l = 75 ? 60 ns t pzl output enable time to low level r l = 180 ? 68 t phz output disable time from high level c l = 10 pf, s1 and s2 closed 45 ns t plz output disable time from low level 53 t skew output-to-output skew c l = 30 pf, s1 and s2 open 9 ns
6 am26ls31 , am26ls31c, am26ls31i , am26ls31m slls114k ? january 1979 ? revised july 2016 www.ti.com product folder links: am26ls31 am26ls31m submit documentation feedback copyright ? 1979 ? 2016, texas instruments incorporated 6.8 typical characteristics a. the a input is connected to v cc during testing of the y outputs and to ground during testing of the z outputs. figure 1. output voltage vs enable g input voltage a. the a input is connected to v cc during testing of the y outputs and to ground during testing of the z outputs. figure 2. output voltage vs enable g input voltage b. the a input is connected to ground during testing of the y outputs and to v cc during testing of the z outputs. figure 3. output voltage vs enable g input voltage b. the a input is connected to ground during testing of the y outputs and to v cc during testing of the z outputs. figure 4. output voltage vs enable g input voltage a. the a input is connected to v cc during testing of the y outputs and to ground during testing of the z outputs. figure 5. high-level output voltage vs free-air temperature a. the a input is connected to v cc during testing of the y outputs and to ground during testing of the z outputs. figure 6. high-level output voltage vs high-level output current v i ? enable g input v oltage ? v ? output v oltage ? v v o v cc = 5.25 v v cc = 5 v v cc = 4.75 v 43 2 1 0 0 1 2 3 5 6 load = 470 ! to v cc t a = 25 c see note b v i ? enable g input v oltage ? v t a = 25 c t a = 0 c t a = 70 c ? output v oltage ? v v o 43 2 1 0 0 1 2 3 5 6 v cc = 5 v load = 470 ! to v cc see note b v i ? enable g input v oltage ? v v cc = 5.25 v v cc = 5 v v cc = 4.75 v load = 470 ! to gnd t a = 25 c see note a ? y output v oltage ? v v o 43 2 1 0 0 1 2 3 v i ? enable g input v oltage ? v v cc = 5 v load = 470 ! to gnd see note a t a = 70 c t a = 0 c t a = 25 c ? y output v oltage ? v v o 43 2 1 0 0 1 2 3 i oh ? high-level output current ? ma v cc = 5.25 v v cc = 4.75 v v cc = 5 v t a = 25 c see note a ? high-level output v oltage ? v v oh 43 2 1 0 0 ?20 ?40 ?60 ?80 ?100 ? high-level output v oltage ? v t a ? free-air temperature ? c i oh = ?20 ma i oh = ?40 ma v oh v cc = 5 v see note a 43 2 1 0 0 25 50 75 5
7 am26ls31 , am26ls31c, am26ls31i , am26ls31m www.ti.com slls114k ? january 1979 ? revised july 2016 product folder links: am26ls31 am26ls31m submit documentation feedback copyright ? 1979 ? 2016, texas instruments incorporated typical characteristics (continued) b. the a input is connected to ground during testing of the y outputs and to v cc during testing of the z outputs. figure 7. low-level output voltage vs free-air temperature b. the a input is connected to ground during testing of the y outputs and to v cc during testing of the z outputs. figure 8. low-level output voltage vs low-level output current figure 9. y output voltage vs data input voltage figure 10. y output voltage vs data input voltage v cc = 5 v v i ? data input v oltage ? v v cc = 4.75 v no load t a = 25 c v cc = 5.25 v ? y output v oltage ? v v o 43 2 1 0 0 1 2 3 5 t a = 25 c no load t a = 0 c t a = 70 c v i ? data input v oltage ? v ? y output v oltage ? v v o 43 2 1 0 0 1 2 3 5 ? low-level output v oltage ? v t a ? free-air temperature ? c v cc = 5 v i ol = 40 ma see note b v ol 0.40.3 0.2 0.1 0 25 50 75 0.5 0 i ol ? low-level output current ? ma v cc = 5.25 v v cc = 4.75 v t a = 25 c see note b ? low-level output v oltage ? v v ol 0.40.3 0.2 0.1 0 40 80 120 0.5 0 100 60 20 0.6 0.7 0.8 0.9 1
8 am26ls31 , am26ls31c, am26ls31i , am26ls31m slls114k ? january 1979 ? revised july 2016 www.ti.com product folder links: am26ls31 am26ls31m submit documentation feedback copyright ? 1979 ? 2016, texas instruments incorporated 7 parameter measurement information figure 11. test circuit and voltage waveforms w aveform 1 (see note e) output z output y input a (see notes b and c) v ol v oh v ol v oh 3 v t phl skew skew t plh t plh t phl 0 v propaga tion dela y times and skew test circuit v cc t est point s1s2 75 w 180 w c l (see note a) from output under t est v oh v ol 1.5 v 0 v 3 v enable g enable g (see note d) s1 open s2 closed s1 closed s2 open t pzh t pzl t phz t plz s1 closeds2 closed 0.5 v 0 v 4.5 v s1 closeds2 closed 1.5 v enable and disable time w aveforms see note d notes: a. c l includes probe and jig capacitance. b. all input pulses are supplied by generators having the following characteristics: prr 1 mhz, z o 50 w , t r 15 ns, t f 6 ns. c. when measuring propagation delay times and skew , switches s1 and s2 are open. d. each enable is tested separately . e. waveform 1 is for an output with internal conditions such that the output is low , except when disabled by the output control. waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. 1.3 v 1.3 v 1.5 v 1.5 v 1.5 v 1.5 v w aveform 2 (see note e) 0.5 v 1.5 v 1.5 v
9 am26ls31 , am26ls31c, am26ls31i , am26ls31m www.ti.com slls114k ? january 1979 ? revised july 2016 product folder links: am26ls31 am26ls31m submit documentation feedback copyright ? 1979 ? 2016, texas instruments incorporated 8 detailed description 8.1 overview the am26ls31 x differential bus transmitter is a monolithic integrated circuit designed for unidirectional data communication on transmission lines. it is designed for balanced transmission lines and meets ansi standard eia/tia-422-b and itu recommendation v.11. the am26ls31 x has a four 3-state differential line drivers that operate from a single 5-v power supply. the driver also integrates active-high and active-low enables for precise device control. the driver is designed to handle loads of a minimum of 30 ma of sink or source current. the driver features positive- and negative-current limiting for protection from line fault conditions. 8.2 functional block diagram 8.3 feature description 8.3.1 complementary output-enable inputs the am26ls31x can be configured using the g and g logic inputs to control transmitter outputs. setting either g to a logic high or g to an logic low enables the transmitter outputs. if g is set to logic low and g is set to logic high, the transmitter outputs are disabled. see table 1 for a complete truth table. 8.3.2 high output impedance in power-off conditions when the am26ls31x transmitter outputs are disabled using g and g, the outputs are set to a high impedance state. 8.3.3 complementary outputs the am26ls31x is the driver half of a pair of devices, with the am26ls32 being the complementary receiver. ti recommends using these devices together for optimal performance, but any rs-422 compliant receive must ensure proper rs-422 communication and logic level translation. 1z 1y g g 1a 412 1 23 2z 2y 2a 7 65 3z 3y 3a 9 10 11 4z 4y 4a 15 1413 copyright ? 2016, texas instruments incorporated
10 am26ls31 , am26ls31c, am26ls31i , am26ls31m slls114k ? january 1979 ? revised july 2016 www.ti.com product folder links: am26ls31 am26ls31m submit documentation feedback copyright ? 1979 ? 2016, texas instruments incorporated 8.4 device functional modes table 1 lists the functional modes of the am26ls31. (1) h = high level, l = low level, x = irrelevant, z = high impedance (off) table 1. function table (1) (each driver) input a enables outputs g g y z h h x h l l h x l h h x l h l l x l l h x l h z z
11 am26ls31 , am26ls31c, am26ls31i , am26ls31m www.ti.com slls114k ? january 1979 ? revised july 2016 product folder links: am26ls31 am26ls31m submit documentation feedback copyright ? 1979 ? 2016, texas instruments incorporated 9 application and implementation note information in the following applications sections is not part of the ti component specification, and ti does not warrant its accuracy or completeness. ti ? s customers are responsible for determining suitability of components for their purposes. customers should validate and test their design implementation to confirm system functionality. 9.1 application information when designing a system that uses drivers, receivers, and transceivers that comply with rs-422 or rs-485, proper cable termination is essential for highly reliable applications with reduced reflections in the transmission line. because rs-422 allows only one driver on the bus, if termination is used, it is placed only at the end of the cable near the last receiver. in general, rs-485 requires termination at both ends of the cable. factors to consider when determining the type of termination usually are performance requirements of the application and the ever-present factor, cost. the different types of termination techniques discussed are unterminated lines, parallel termination, ac termination, and multipoint termination. laboratory waveforms for each termination technique (except multipoint termination) illustrate the usefulness and robustness of rs-422 (and, indirectly, rs- 485). similar results can be obtained if 485-compliant devices and termination techniques are used. for laboratory experiments, 100 feet of 100- , 24-awg, twisted-pair cable (bertek) was used. a single driver and receiver, ti am26ls31 and am26ls32c, respectively, were tested at room temperature with a 5-v supply voltage. two plots per termination technique are shown. in each plot, the top waveform is the driver input and the bottom waveform is the receiver output. to show voltage waveforms related to transmission-line reflections, the first plot shows output waveforms from the driver at the start of the cable; the second plot shows input waveforms to the receiver at the far end of the cable. 9.2 typical application figure 12. encoder application a d b z status r d r d r d r am26ls31 am26ls32 encoder interpolation electronics encoder phase a encoder phase b encoder index status xxx xxx xxx xxx xxx xxx xxx xxx xxx xxx xxx servo drive motion controller copyright ? 2016, texas instruments incorporated
12 am26ls31 , am26ls31c, am26ls31i , am26ls31m slls114k ? january 1979 ? revised july 2016 www.ti.com product folder links: am26ls31 am26ls31m submit documentation feedback copyright ? 1979 ? 2016, texas instruments incorporated typical application (continued) 9.2.1 design requirements this example requires the following: ? 5-v power source ? rs-485 bus operating at 10 mbps or less ? connector that ensures the correct polarity for port pins 9.2.2 detailed design procedure place the device close to bus connector to keep traces (stub) short to prevent adding reflections to the bus line. if desired, add external fail-safe biasing to ensure 200 mv on the a-b port, if the drive is in high impedance state (see failsafe in rs-485 data buses ). 9.2.3 application curve figure 13. differential 120- terminated output waveforms (cat 5e cable) 3 2 1 0 1 2 3 4 5 0 0.1 0.2 0.3 0.4 0.5 voltage (v) time ( s) y a/b c001
13 am26ls31 , am26ls31c, am26ls31i , am26ls31m www.ti.com slls114k ? january 1979 ? revised july 2016 product folder links: am26ls31 am26ls31m submit documentation feedback copyright ? 1979 ? 2016, texas instruments incorporated 10 power supply recommendations place a 0.1- f bypass capacitors close to the power-supply pins to reduce errors coupling in from noisy or high impedance power supplies. 11 layout 11.1 layout guidelines for best operational performance of the device, use good pcb layout practices, including: ? noise can often propagate into analog circuitry through the power supply of the circuit. bypass capacitors are used to reduce the coupled noise by providing low impedance power sources local to the analog circuitry. ? connect low-esr, 0.1- f ceramic bypass capacitors between each supply pin and ground, placed as close to the device as possible. a single bypass capacitor from v+ to ground is applicable for single- supply applications. ? separate grounding for analog and digital portions of circuitry is one of the simplest and most-effective methods of noise suppression. one or more layers on multilayer pcbs are usually devoted to ground planes. a ground plane helps distribute heat and reduces emi noise pickup. make sure to physically separate digital and analog grounds, paying attention to the flow of the ground current. ? to reduce parasitic coupling, run the input traces as far away from the supply or output traces as possible. if it is not possible to keep them separate, it is much better to cross the sensitive trace perpendicular as opposed to in parallel with the noisy trace. ? place the external components as close to the device as possible. keeping rf and rg close to the inverting input minimizes parasitic capacitance. ? keep the length of input traces as short as possible. always remember that the input traces are the most sensitive part of the circuit. 11.2 layout example figure 14. layout recommendation am26ls31 12 3 4 5 6 7 8 16 15 14 13 12 11 10 9 v cc 0.1uf reduce logic signal trace where possible 1a gnd v cc
14 am26ls31 , am26ls31c, am26ls31i , am26ls31m slls114k ? january 1979 ? revised july 2016 www.ti.com product folder links: am26ls31 am26ls31m submit documentation feedback copyright ? 1979 ? 2016, texas instruments incorporated 12 device and documentation support 12.1 documentation support 12.1.1 related documentation for related documentation, see the following: failsafe in rs-485 data buses (slyt080) 12.2 related links the table below lists quick access links. categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. table 2. related links parts product folder sample & buy technical documents tools & software support & community am26ls31 click here click here click here click here click here am26ls31c click here click here click here click here click here am26ls31i click here click here click here click here click here am26ls31m click here click here click here click here click here 12.3 receiving notification of documentation updates to receive notification of documentation updates, navigate to the device product folder on ti.com. in the upper right corner, click on alert me to register and receive a weekly digest of any product information that has changed. for change details, review the revision history included in any revised document. 12.4 community resources the following links connect to ti community resources. linked contents are provided "as is" by the respective contributors. they do not constitute ti specifications and do not necessarily reflect ti's views; see ti's terms of use . ti e2e ? online community ti's engineer-to-engineer (e2e) community. created to foster collaboration among engineers. at e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. design support ti's design support quickly find helpful e2e forums along with design support tools and contact information for technical support. 12.5 trademarks e2e is a trademark of texas instruments. all other trademarks are the property of their respective owners. 12.6 electrostatic discharge caution these devices have limited built-in esd protection. the leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the mos gates. 12.7 glossary slyz022 ? ti glossary . this glossary lists and explains terms, acronyms, and definitions. 13 mechanical, packaging, and orderable information the following pages include mechanical packaging and orderable information. this information is the most current data available for the designated devices. this data is subject to change without notice and revision of this document. for browser based versions of this data sheet, refer to the left hand navigation.
package option addendum www.ti.com 27-aug-2016 addendum-page 1 packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish (6) msl peak temp (3) op temp (c) device marking (4/5) samples 5962-7802301m2a active lccc fk 20 1 tbd post-plate n / a for pkg type -55 to 125 5962- 7802301m2a am26ls31 mfkb 5962-7802301mea active cdip j 16 1 tbd a42 n / a for pkg type -55 to 125 5962-7802301me a am26ls31mjb 5962-7802301mfa active cfp w 16 1 tbd a42 n / a for pkg type -55 to 125 5962-7802301mf a am26ls31mwb 5962-7802301q2a active lccc fk 20 1 tbd post-plate n / a for pkg type 5962- 7802301q2a am26ls31m am26ls31cd active soic d 16 40 green (rohs & no sb/br) cu nipdau level-1-260c-unlim 0 to 70 am26ls31c am26ls31cdbr active ssop db 16 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim 0 to 70 sa31c AM26LS31CDBRE4 active ssop db 16 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim 0 to 70 sa31c am26ls31cde4 active soic d 16 40 green (rohs & no sb/br) cu nipdau level-1-260c-unlim 0 to 70 am26ls31c am26ls31cdg4 active soic d 16 40 green (rohs & no sb/br) cu nipdau level-1-260c-unlim 0 to 70 am26ls31c am26ls31cdr active soic d 16 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim 0 to 70 am26ls31c am26ls31cdre4 active soic d 16 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim 0 to 70 am26ls31c am26ls31cdrg4 active soic d 16 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim 0 to 70 am26ls31c am26ls31cn active pdip n 16 25 pb-free (rohs) cu nipdau n / a for pkg type 0 to 70 am26ls31cn am26ls31cne4 active pdip n 16 25 pb-free (rohs) cu nipdau n / a for pkg type 0 to 70 am26ls31cn am26ls31cnsr active so ns 16 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim 0 to 70 26ls31
package option addendum www.ti.com 27-aug-2016 addendum-page 2 orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish (6) msl peak temp (3) op temp (c) device marking (4/5) samples am26ls31mfkb active lccc fk 20 1 tbd post-plate n / a for pkg type -55 to 125 5962- 7802301m2a am26ls31 mfkb am26ls31mjb active cdip j 16 1 tbd a42 n / a for pkg type -55 to 125 5962-7802301me a am26ls31mjb am26ls31mwb active cfp w 16 1 tbd a42 n / a for pkg type -55 to 125 5962-7802301mf a am26ls31mwb (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. - the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. (4) there may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) multiple device markings will be inside parentheses. only one device marking contained in parentheses and separated by a "~" will appear on a device. if a line is indented then it is a continuation of the previous line and the two combined represent the entire device marking for that device. (6) lead/ball finish - orderable devices may have multiple material finish options. finish options are separated by a vertical ruled line. lead/ball finish values may wrap to two lines if the finish value exceeds the maximum column width.
package option addendum www.ti.com 27-aug-2016 addendum-page 3 important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis. other qualified versions of am26ls31, am26ls31m : ? catalog: am26ls31 ? military: am26ls31m note: qualified version definitions: ? catalog - ti's standard catalog product ? military - qml certified for military and defense applications
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant am26ls31cdbr ssop db 16 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 q1 am26ls31cdr soic d 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 q1 am26ls31cdr soic d 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 q1 am26ls31cdrg4 soic d 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 q1 am26ls31cdrg4 soic d 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 q1 package materials information www.ti.com 27-aug-2016 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) am26ls31cdbr ssop db 16 2000 367.0 367.0 38.0 am26ls31cdr soic d 16 2500 333.2 345.9 28.6 am26ls31cdr soic d 16 2500 367.0 367.0 38.0 am26ls31cdrg4 soic d 16 2500 333.2 345.9 28.6 am26ls31cdrg4 soic d 16 2500 367.0 367.0 38.0 package materials information www.ti.com 27-aug-2016 pack materials-page 2

mechanical data msso002e ? january 1995 ? revised december 2001 post office box 655303 ? dallas, texas 75265 db (r-pdso-g**) plastic small-outline 4040065 /e 12/01 28 pins shown gage plane 8,20 7,40 0,55 0,95 0,25 38 12,90 12,30 28 10,50 24 8,50 seating plane 9,90 7,90 30 10,50 9,90 0,38 5,60 5,00 15 0,22 14 a 28 1 20 16 6,50 6,50 14 0,05 min 5,90 5,90 dim a max a min pins ** 2,00 max 6,90 7,50 0,65 m 0,15 0 ? 8 0,10 0,09 0,25 notes: a. all linear dimensions are in millimeters. b. this drawing is subject to change without notice. c. body dimensions do not include mold flash or protrusion not to exceed 0,15. d. falls within jedec mo-150

important notice texas instruments incorporated and its subsidiaries (ti) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per jesd46, latest issue, and to discontinue any product or service per jesd48, latest issue. buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. all semiconductor products (also referred to herein as ? components ? ) are sold subject to ti ? s terms and conditions of sale supplied at the time of order acknowledgment. ti warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in ti ? s terms and conditions of sale of semiconductor products. testing and other quality control techniques are used to the extent ti deems necessary to support this warranty. except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. ti assumes no liability for applications assistance or the design of buyers ? products. buyers are responsible for their products and applications using ti components. to minimize the risks associated with buyers ? products and applications, buyers should provide adequate design and operating safeguards. ti does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which ti components or services are used. information published by ti regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from ti under the patents or other intellectual property of ti. reproduction of significant portions of ti information in ti data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. ti is not responsible or liable for such altered documentation. information of third parties may be subject to additional restrictions. resale of ti components or services with statements different from or beyond the parameters stated by ti for that component or service voids all express and any implied warranties for the associated ti component or service and is an unfair and deceptive business practice. ti is not responsible or liable for any such statements. buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of ti components in its applications, notwithstanding any applications-related information or support that may be provided by ti. buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. buyer will fully indemnify ti and its representatives against any damages arising out of the use of any ti components in safety-critical applications. in some cases, ti components may be promoted specifically to facilitate safety-related applications. with such components, ti ? s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. nonetheless, such components are subject to these terms. no ti components are authorized for use in fda class iii (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. only those ti components which ti has specifically designated as military grade or ? enhanced plastic ? are designed and intended for use in military/aerospace applications or environments. buyer acknowledges and agrees that any military or aerospace use of ti components which have not been so designated is solely at the buyer ' s risk, and that buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. ti has specifically designated certain components as meeting iso/ts16949 requirements, mainly for automotive use. in any case of use of non-designated products, ti will not be responsible for any failure to meet iso/ts16949. products applications audio www.ti.com/audio automotive and transportation www.ti.com/automotive amplifiers amplifier.ti.com communications and telecom www.ti.com/communications data converters dataconverter.ti.com computers and peripherals www.ti.com/computers dlp ? products www.dlp.com consumer electronics www.ti.com/consumer-apps dsp dsp.ti.com energy and lighting www.ti.com/energy clocks and timers www.ti.com/clocks industrial www.ti.com/industrial interface interface.ti.com medical www.ti.com/medical logic logic.ti.com security www.ti.com/security power mgmt power.ti.com space, avionics and defense www.ti.com/space-avionics-defense microcontrollers microcontroller.ti.com video and imaging www.ti.com/video rfid www.ti-rfid.com omap applications processors www.ti.com/omap ti e2e community e2e.ti.com wireless connectivity www.ti.com/wirelessconnectivity mailing address: texas instruments, post office box 655303, dallas, texas 75265 copyright ? 2016, texas instruments incorporated

▲Up To Search▲

Price & Availability of AM26LS31CDBRE4

	To Download AM26LS31CDBRE4 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .